The Orange Pi 5 Pro was released not long ago, I bought one right away. It took half a month to ship from China Mainland, and I just received it 2 days ago. I did this simple test to figure out the best heat dissipation method. The test results should also be applicable to a number of single-board development boards such as Raspberry Pi. Hope it helps. blog.ensonyan.com – All Rights Reserved.
Device:
- Orange Pi 5 Pro (16GB RAM) RK3588S
- Aluminum Heat Sink
- Fan (30 x 30mm) 1.4 CFM
Test Cases:
Group #1: No Heat Sink | Group #2: Aluminum Heat Sink |
1.1: With Case / No Fan | 1.1: With Case / No Fan |
1.2: With Case / Fan Blow Outwards | 2.2: With Case / Fan Blow Outwards |
1.3: With Case / Fan Blow Inwards | 2.3: With Case / Fan Blow Inwards |
Test Results:


Conclusion:
In both sets of tests, the fan blowing inward was the optimal solution.
Note:
- Video versions are available on both YouTube and Bilibili.
- * For reference only. Inaccuracy might occur.
Attachments (Screenshots):
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