[en] Optimizing Heat Dissipation Strategies for Single Board Development Boards

The Orange Pi 5 Pro was released not long ago, I bought one right away. It took half a month to ship from China Mainland, and I just received it 2 days ago. I did this simple test to figure out the best heat dissipation method. The test results should also be applicable to a number of single-board development boards such as Raspberry Pi. Hope it helps. blog.ensonyan.com – All Rights Reserved.


Device:

  • Orange Pi 5 Pro (16GB RAM) RK3588S
  • Aluminum Heat Sink
  • Fan (30 x 30mm) 1.4 CFM

Test Cases:

Group #1: No Heat SinkGroup #2: Aluminum Heat Sink
1.1: With Case / No Fan1.1: With Case / No Fan
1.2: With Case / Fan Blow Outwards2.2: With Case / Fan Blow Outwards
1.3: With Case / Fan Blow Inwards2.3: With Case / Fan Blow Inwards

Test Results:

Test Case 1 - No Heat Sink
Test Case #1: No Heat Sink
Test Case 2 - Aluminum Heat Sink
Test Case #2: Aluminum Heat Sink

Conclusion:

In both sets of tests, the fan blowing inward was the optimal solution.


Note:

  1. Video versions are available on both YouTube and Bilibili.
  2. * For reference only. Inaccuracy might occur.

Attachments (Screenshots):

Orange Pi 5 Pro - Heat Dissipation Test_Page_3
Orange Pi 5 Pro – Heat Dissipation Test_Page_3
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EnsonYan

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目前正在加拿大攻读游戏设计相关学位。IT / 摄影 / 汽车爱好者

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[en] Optimizing Heat Dissipation Strategies for Single Board Development Boards
The Orange Pi 5 Pro was released not long ago, I bought one right away. It took half a month to ship from China Mainland, and I just received it 2 days ago. I did this simple…
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2024-06-02